_______PC Board Layout Guidelines
To take advantage of the switch response time to an
output fault condition, keep all traces as short as possi-
ble and maximize the high-current trace width to
reduce the effect of undesirable parasitic inductance.
The MOSFET dissipates a fair amount of heat due to
the high currents involved, especially during an over-
current condition. In order to dissipate the heat gener-
ated by the MOSFET, make the power traces very wide
with a large amount of copper area. A more efficient
way to achieve good power dissipation on a surface-
mount package is to lay out two copper pads directly
under the MOSFET package on both sides of the
board. Connect the two pads to the ground plane
through vias, and use enlarged copper mounting pads
on the top side of the board.
Minimize the current-sense resistor trace length
(<10mm), and ensure accurate current sensing with
Kelvin connections. Place capacitor CTIM as close as
possible to the IC. The traces from the current-sense
resistor to IN and ISET should be as short as possible
for accurate current sensing. Place the MAX8533 cir-
cuit as close as possible to the backplane connector. A
sample PC board layout is available in the MAX8533
Evaluation Kit.
Smallest, Most Reliable, 12V, Infiniband-
Compliant Hot-Swap Controller
_______________________________________________________________________________________ 9
Chip Information
TRANSISTOR COUNT: 2541
PROCESS: BiCMOS
1
2
3
4
5
10
9
8
7
6
EN
LPEN
POK
OUT
CTIM
GATE
IN
ISET
MAX8533
?SPAN class="pst MAX8533EUB-T_2342242_8">MAX
TOP VIEW
OVP
RET
Pin Configuration
发布紧急采购，3分钟左右您将得到回复。
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